With the state of the art technology and hard work of R&D department, our company makes full use of the advanced production technology - nitrogen atomized protection method, to produce the product with the technical specifications in full compliance with national military standard GJB1738-93 and the American military standard MIL-DTL-512B.. It combines the centrifugal grading and whirlwind grading classification to adjust accurately the products particle sizes between 1-45 micron. Please kindly refer to the following production specification:
|
Particle Size (μm) |
Aluminum Min(%) |
Active Aluminum Min(%) |
Impurities Max(%) |
|||
|
Fe |
Si |
Cu |
H2O |
|||
|
1~2 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
2~3 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
3~4 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
4~5 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
5~6 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
6~7 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
7~8 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
8~10 |
99.75 |
98 |
0.09 |
0.06 |
0.01 |
0.08 |
|
9~11 |
99.80 |
98 |
0.08 |
0.06 |
0.01 |
0.05 |
|
11~13 |
99.80 |
98 |
0.08 |
0.06 |
0.01 |
0.05 |
|
13~15 |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
15~17 |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
17~19 |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
19~21 |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
21~23 |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
23~25 |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
-325 mesh |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
|
-200 mesh |
99.80 |
98 |
0.08 |
0.04 |
0.01 |
0.05 |
Application For Spherical Aluminum Powder：
1. Conductive Aluminum Paste (Solar Cell and Solar Panel Paste)
2. Military Industry (Solid Rocket Propellant Additive, Aerospace and Explosive Material)
3. Metallurgy Industry (Thermal Welding, Deoxidation In Steel-Making)
4. Chemical Industry (Aluminum paste for coatings, Chemical Additive)
5. Refractory Material (Magnesia Carbon Brick)
6. Composite Material (Ceramic, Thermal Spraying Metal Powder)
7. Advanced Material（For High Temperature Membrane Separation, Electronic Material）
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